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Soldering improvement agent

Post-treatment agent for improving the solder wettability of nickel plating.

Improves the solder wettability of nickel plating. Nickel plated surfaces generally have poor solder wettability, but High Solder G enhances solder wettability simply by immersion treatment after plating. ◆ Treatment Method Nickel plating ⇒ Rinsing (several times) ⇒ High Solder G immersion treatment ⇒ Rinsing ⇒ Drying

  • Fine Ceramics
  • Improved adhesive

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